Vacuum Technology & Application Consultancy

Sputtering RF and DC Magnetrons


Sputtering RF and DC Magnetrons

Vac Techniche

Also known as:
  • Sputtering guns,
  • Magnetron Sputtering
  • cathode Diodes
There are two specific methods of Sputtering.


DC Sputtering
Also known as Direct Current Diode Sputtering and it is the most basic type of sputtering. Ionized Argon cations are accelerated towards the cathode with the use of a negative bias voltage. Upon the collision of Argon with the cathode (where the target material is placed), species from the target source are ejected and subsequently get deposited on the substrate.


RF Sputtering
It is ideal for use with electrically insulating or dielectric target materials or substrates such as ceramics. It allows a much lower Argon pressure than the DC counterpart (1-15 mTorr vs 100 mTorr) to be used, which in turn reduces the concentration of gas impurities and in the chamber while also improving the deposition’s line of sight due to fewer gas collisions.


Magnetron Sputtering
This sputtering feature greatly increases the sputtering rate by concentrating ions and electrons in a confined region above the cathode. By trapping electrons near the target material using a magnetic field, the ionization of Argon is greatly increased while also further lowering the gas pressure to 0.5 mTorr to improve the deposition’s line of sight even more.


The characteristics above offer improved deposition rate decreased impurities of coatings and allow for operating under lower substrate temperatures in depositions. This type of sputtering can be used in conjunction with a DC or RF power source.


Vac Techniche has developed a single style magnetron that is compatible for both DC and RF power sources, they are manufactured to work effortlessly with the Vac Techniche plasma power sources.


Sputtering Cathode Matrix with PSU
Sputtering RF and DC Magnetrons